Samsung and Western Digital begin far-reaching collaboration to drive standardization of next-generation storage technologies for broader ecosystem support and customer adoption

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Companies will be the first to lead the standardization of zoned storage technology;
Cooperative efforts include the development and promotion of hardware specifications and software application models to create a robust ecosystem

Samsung Electronics Co., Ltd. and Western Digital (Nasdaq: WDC) today announced the signing of a Memorandum of Understanding for a unique collaboration to standardize and drive wide adoption of placement, processing and array storage technologies next-generation data (D2PF). Companies will initially focus on aligning their efforts and creating a vigorous ecosystem for zoned storage solutions. These steps will allow the industry to focus on countless applications that ultimately create greater value for customers.

This is the first time that Samsung and Western Digital have come together as technology leaders to create widespread alignment and drive awareness of important storage technologies. Focusing on enterprise and cloud applications, the partnership is expected to spur a range of collaborations around technology standardization and software development for D2PF technologies such as Zoned Storage. Through this collaboration, end users can be confident that these emerging storage technologies will be supported by multiple device vendors as well as vertically integrated hardware and software companies.

“Storage is the essential foundation of how people and businesses consume and use data. To meet the needs of today and the next big ideas of tomorrow, we must innovate, collaborate and keep pace as an industry by bringing new standards and architectures to life,” said Rob Soderbery, EVP and GM, Flash Business Unit at Western Digital. “For a technology ecosystem to succeed, the overarching frameworks and overarching solution patterns must come together so that they don’t suffer from fragmentation, which delays adoption and adds unnecessary complexity for software stack developers.”

Added Soderbery, “For years, Western Digital has laid the foundation for the Zoned Storage ecosystem by contributing to the Linux kernel and open source software community. We are excited to make these contributions to this joint initiative with Samsung to facilitate wider adoption of zoned storage for users and app developers.

“This collaboration is a testament to our tireless efforts to exceed our customers’ current and future needs, and holds special significance in how we anticipate it will actively grow into a broader base of engagement for storage standardization. by areas”, said Jinman Han, Corporate EVP, Head of Memory Sales & Marketing at Samsung Electronics. “Our collaborative efforts will span both hardware and software ecosystems to ensure that as many customers as possible can enjoy the benefits of this very important technology.”

The two companies have already launched an initiative around Zoned storage devices, including ZNS (Zoned Namespaces) SSDs and SMR (Shingled Magnetic Recording) hard drives. Through organizations such as the Storage Networking Industry Association (SNIA) and the Linux Foundation, Samsung and Western Digital will define high-level models and frameworks for next-generation zoned storage technologies. Committed to enabling open and scalable data center architectures, they founded the Zoned Storage TWG (Technical Work Group), which was approved by SNIA in December 2021. The group is already defining and specifying use cases common for zoned storage devices, as well as host/device architecture and programming models.

Additionally, this collaboration is expected to serve as a starting point for expanding zone-based device interfaces (e.g., ZNS, SMR), as well as next-generation high-capacity storage devices with improved placement and processing technologies. Datas. At a later stage, these initiatives will be expanded to include other emerging D2PF technologies such as compute storage and storage fabrics, including NVMe™ over Fabrics (NVMe-oF).

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